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Prevention of Failure Modes in Wire Dies

The 4 Primary Types of Cracks or Fractures
Seen in Returned Wire Dies

U-Shaped Cracks

Pitting

Wear Rings

Vertical Cracks

Horizontal Cracks

Web or Multiple Cracks

Rough Diamond Surface

Die Breakage

Important Guidelines for Wire Die End Users

Important Guidelines for Material Returns

Please use this pdf for a complete printout
English | Spanish | Chinese

 
Prevention of Failure Modes in Wire Dies

Web or Multiple Cracks

Description
Numerous cracks travelling in non-uniform directions.

Causes

  • Wear ring generated during wire drawing process.
  • Misaligned die during mounting process induces stress.
  • Excessive thermal damage either from laser, sintering, wire drawing or re-cutting.
  • Thin diamond wall from oversize bore diameter.

 

Rough Diamond Surface



Description
A rough diamond surface is an area in the bore hole that is difficult or impossible to polish due to voids between the diamond crystals. This area can be granular in appearance. Pull out of diamond crystals may occur due to melting of the cobalt secondary phase between the diamond grain.

Causes

  • Excessive thermal damage either from laser drilling, sintering or wire drawing.
  • Wear caused from interrupted lubrication.
  • Unsintered diamond or cold spot. Usually isolated to a localized region of the diamond table.

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