Self Supported
Compax Diamond Blanks |
Free standing polycrystalline (PCD)
diamond cylinders
Grain Sizes - Average Particle Size
Product Description
TS Grade
Catalyst metal removed.
Thermally stable up to 1200°C in an inert or reducing atmosphere.
Can be mounted using high temperature, high strength metal setting powders.
Not electrically conductive: EDM not recommended for piercing/shaping.
Use laser, ultrasonic or needle piercing/shaping methods.
MF Grade
Metal filled, contains catalyst metal.
Thermally stable up to 700°C.
Do not exceed 700°C in blank mounting.
Electrically conductive: EDM, laser, ultrasonic or needle methods for piercing/shaping
die bore may be used.
Polishing
Diamond Micron Powder SJK-5 or GMM series recommended for final die bore shaping
and polishing.
For superior polish use 0.25 µm or 0.5 µm graded diamond fines.
Recommended Applications
TS or MF Grade
Drawing of high carbon steel tire cord.
Drawing of smaller diameter and critical surfacefinish nonferrous and ferrous
wires.
TS Grade
High temperature drawing of tungsten/molybdenum.
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Tungsten Carbide
Supported
Compax Diamond Blanks |
Polycrystalline diamond (PCD) core integrally bonded to a tungsten
carbide support ring
Grain Sizes - Average Particle Size
Product Description
All blanks contain metal catalyst in PCD structure. Do not exceed 700°C in
die mounting operations.
Electrically conductive: Diamond core may be pierced using either EDM, laser,
ultrasonic or needle methods.
Profiling of die geometry is normally performed using shaped needles with EDM
or ultrasonic machines with diamond abrasives.
Polishing
Diamond Micron Powder SJK-5 or GMM series recommended for final die bore shaping
and polishing.
For superior polish use 0.25 µm or 0.5 µm graded diamond fines.
Recommended Applications
25 µm and 50 µm Grain Sizes
Intermediate and rod break down drawing of copper, aluminum and other nonferrous
materials.
5 µm and 25 µm Grain Sizes
Nonferrous and ferrous intermediate and fine wires. Applications where superior
surface quality is a must.
3 µm and 5 µm Grain Sizes
Nonferrous and ferrous wire in finer sizes.
Critical surface finish applications.
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